The user's demand for thinner cores and more layers of backplane brings two opposite requirements for the conveying system.

When a high power consumption application card is inserted into the backplane, the copper layer thickness must be appropriate to provide the required current to ensure that the card can work normally. 

All these factors lead to an increase in the average weight of the backplane, which requires that the conveyor belt and other conveying systems must not only be able to safely transfer large size raw material boards, 

but also take into account the fact that their weight increases. Because the backplane is thicker than the conventional PCB, and the number of holes is much more, it is easy to cause the outflow of processing fluid. 

In order to minimize the liquid carrying capacity and eliminate the possibility of any drying impurities left at the pilot hole, it is extremely important to clean the drill hole with high-pressure flushing and air blower.