SEAMLESS TRANSFER FROM PROTOTYPE TO VOLUME PRODUCTION WITH CAMTECH PCB
HIGH LAYER COUNT, HIGH-PERFORMANCE MATERIALS, IMPEDANCE CONTROL, SIGNAL INTEGRITY, ETC.
HDI, VIA-IN-PAD PLATED OVER (VIPPO), BACK-DRILLING, SEMI-FLEX/ONE-TIME FLEX
HEAVY COPPER (2-12OZ), INSULATED METAL SUBSTRATES (IMS)
COPPER COINS (EMBEDDED AND PRESS-FIT), METAL CORE HEATSINK (ALUMINUM & COPPER), HEATSINK PASTE
90GHZ VNA TESTING CAPABILITY IN GUANGZHOU SUPPORTED BY 110GHZ FROM SYRACUSE
STATE-OF-THE-ART R&D LAB IN GUANGZHOU TO SUPPORT EXTENSIVE MATERIALS TESTING, METROLOGY, AND FAILURE ANALYSIS CAPABILITIES
1. Streamlined quoting including one-time NRE / test charges
2. Data transfer packages including "best practices" for manufacturing
3. Common / in-parallel stack-ups and DFM reviews
4. Common materials for both standard FR4 and high-speed
5. Efficient technical query ("TQ") process