CAMTECH PCB
SUPPORTS INNOVATIVE, ADVANCED TECHNOLOGY APPLICATIONS REQUIRING OR ENABLING 5G
Camtech PCB provides active and passive products for a wide variety of commercial and non-commercial applications. From Wi-Fi differential input baluns used in brand name manufacturer products to SMT components used in conjunction with market-leading RF integrated circuits and more. We continue to invest in the processes and capabilities that
CAPABILITIES TO SUPPORT 5G ENABLEMENT/CONNECTIVITY
HIGH-DENSITY INTERCONNECT( HDI ) PCBS
Including anylayer HDI: All the layers of a PCB are high-density interconnection layers that allow the conductors on any PCB layer to be interconnected with copper-filled stacked microvia structures ("anylayer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld devices.
Find out how high-density interconnect PCBs might be
suitable for your application
High Performance, High-Density Solutions for Advanced Applications
