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Markets We Serve
CAMTECH PCB'S
LEADING-EDGE CAPABILITIES DELIVER RELIABLE ADVANCED TECHNOLOGY SOLUTIONS
We are recognized as an industry- professional provider of advanced technology PCB product solutions across the telecommunications & networking market. Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

Camtech PCB has expertise in RF and specialty components, engineered thermal solutions, and advanced photonics packaging that set us apart from other PCB manufacturers. Our value goes beyond PCB and offers an integrated,
complete solution to support your full product lifecycle.
CAMTECH PCB
HAS A NUMBER OF SOLUTIONS AND BROAD EXPERTISE FOR
NETWORKING AND TELECOMMUNICATIONS APPLICATIONS​​​​​​​

CONVENTIONAL PCBS

Conventional PCBs can be any layer count but rely on conventional drilling and plating technology.

RF / MICROWAVE PCBS

All cellular devices require a network of base stations to function. The base station antennas transmit and receive RF signals, or radio waves, to and from mobile phones near the base station.

HIGH-DENSITY INTERCONNECT ( HDI )PCBS

HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products.

RF AND SPECIALTY COMPONENTS

Camtech PCB manufactures a range of passive components used extensively in cellular base stations and tower mounted hardware. These products are critical signal path products that allow our customers the highest levels of performance while keeping costs down. We also offer expertise in advanced photonics packaging, engineered thermal solutions, and integrated RF solutions. Our teams have deep expertise in this area and we continue to offer differentiated products that support our innovative customer-base.

  • 1
    High Layer-Count
  • 2
    Laser Microvias
  • 3
    Advanced Materials
  • 4
    High-Volume 2.0 Core Material
  • 5
    Hybrid & Sequential Structures
  • 6
    Thermal Management Solutions
  • 7
    Oversized Line Card and Backplaned
  • 8
    Advanced And Conventional High-Density Interconnect(Hdi) Pcbs
LEAVE US A MESSAGE​​​​​​​
The first thing we do is meeting with our clients and talk through their goals on a future project. During this meeting, feel free to communicate your ideas and ask lots of questions.
WILLKOMMEN ZUR BERATUNG!
ingYuan factory:
M1-04 and 05A, YingFu Industrial Area Anfeng Industrial Park,QingYuan High-Tech Development Zone,QingYuan City, Guangdong Province, China ZhuHai factory:
No.1388, Qixing Avenue, Fushan Industrial Park, Qianyuan Town, Doumen District, Zhuhai City ,Guangdong, China

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Email: info@camtechcircuits.com
Tel.: +86 13713989501
WeChat: +86-13713989501

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Hongkong Add: Room 023 9/f Block G Kwai Shing Ind Bldg (stage 2)42-46 Tai Lin Pai Rd Kwaichung Nt

Room 916, Huafeng International Building, No. 4018 Baoan Avenue, Baoan District, Shenzhen, Guangdong, China 518102
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