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The IC Substrate is mainly used to carry the IC, and the internal wiring is used to conduct the signal between the chip and the circuit board.
In addition to the carrying function, the IC Substrate also has additional functions such as protecting the circuit, special lines,
designing heat dissipation channels, and establishing modular standards for components.
IC carrier board is a product based on BGA (Ball Grid Array, Ball Matrix Array or Ball Array) architecture.
Its manufacturing process is similar to that of PCB products, but its precision is greatly improved, and there are differences between IC carrier board and PCB in material design,
equipment selection, and subsequent manufacturing process. IC carrier board has become a key component in IC packaging, gradually replacing the application of some Lead Frame.
China's IC packaging industry has always been the first pillar industry in the IC industry chain. According to the statistics of CCID Consulting,
the domestic IC packaging and testing industry achieved a total sales revenue of 62.77 billion yuan in 2007, with a year-on-year growth of 26.4%, maintaining a rapid development momentum.
At present, domestic packaging enterprises such as Changdian Technology, Nantong Fujitsu, Tianshui Huatian and China Resources AXA are catching up with the scale of packaging test in recent years,
and the product grade is also developing from low-end to high-end. The packaging level of Changdian Technology has been in line with the international advanced level.
These developments can be said to be inseparable from innovation. Innovative technologies close to the market directly drive the rapid and healthy development of enterprises.
With the continuous reduction of IC device size and the continuous improvement of computing speed, packaging technology has become a very critical technology.
