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Optical module is composed of optoelectronic devices, functional circuits, optical interfaces, etc. The function of optical module is photoelectric conversion.
The sending end converts electrical signals into optical signals, which are transmitted through optical fibers, and the receiving end converts optical signals into electrical signals.
This project studies the optical module PCB, which is characterized by that the printed plug is designed as a long and short plug,
and the process production adopts the gold plating method to ensure that there is no lead at the gold finger position.
The common ones are SFP, SFP+, SFF, Gigabit Ethernet Interface Converter (GBIC), etc.
The optical module is mainly used to realize the mutual conversion of optical signal and electrical signal, and is the core relay of photoelectric signal conversion in optical communication equipment.
In the cost structure of optical modules, optical devices account for 37%; IC chips accounted for 22%; Optical chips accounted for 19%; Structural members account for 11%;
Low value consumables account for 6%; PCB accounts for 5%.
China's optical module industry has gradually become the world's largest optical communication market with the efforts of attaching importance to investment in technology research and development,
and adhering to independent innovation, since it initially provided low-end products with low speed.
Optical module is one of the core components of optical communication, which is used in data communication applications and telecommunications applications.
Among them, digital communication applications account for 51%; Telecommunications applications account for 49%.
