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The gold layer used by Bonding is generally soft gold. Both chemical gold and electrogilding can be used in theory, but it must have sufficient thickness.
Due to different operating conditions and different base materials, the required minimum gold plating thickness is also different.
Hard gold contains more impurities, so the binding force in the wire laying operation cannot be fully formed, so hard gold is not suitable for wire laying.
According to professionals, in fact, the binding force of the wire is due to the binding force between the gold wire and the nickel at the bottom layer.
Therefore, if it is hard gold, I'm afraid that the gold wire used for the wire cannot penetrate the gold plating layer, so in theory, hard gold is not suitable for the wire.
For the chip packaged with wire bond, the maximum length of the bonding wire is generally 4.5~5mm.
If the length is too long, it is easy to cause defects due to the collapse of the bonding wire when packaging.
The smaller the die size of the chip, the longer the bonding wire may be required.
The smaller the EPAD, the longer the fingers of the leadframe can be extended, and the bonding wire length can be shortened.
